thermal measurement report date: 5/8/96 revised 11/18/96 package description: package: 240 32 x 32 mm qfp die down flag: 10.6 mm square leadframe: sidn 1234625 die attach: jmi 2500an mold compound: sumitomo 7304lc assembled: anam die: pst6 - 10.16 mm square junction to ambient thermal resistance or theta ja (r q ja ) was measured per semi test method g38-87 at 1.5 watts in a horizontal configuration. the test board conforms to eia/jesd 51-3; it is a single layer 115x102 mm board designed to test 0.5 mm pitch qfp packages from 208 to 304 leads. the trace width is 0.24 mm, trace thickness is 0.076 mm. sample size was 5. convection theta ja average standard deviation theta ja ave + 3 std. dev. ?/watt ?/watt ?/watt natural 31.0 0.08 31.3 100 ft/min 27.7 0.18 28.3 200 26.1 0.1 26.4 400 23.7 0.34 24.7 800 19.9 0.11 20.2 "thermal resistance" from junction to a thermocouple on top center of case, previously titled theta j-ref (r q jr ), was been renamed by the industry standard committee jedec jc15.1 as y jt and defined in eia/jesd51-2. it is a useful value to use to estimate junction temperature in steady state customer environments. convection y jt average standard deviation ?/watt ?/watt natural 1.9 0.09 100 ft/min 2.3 0.06 200 2.5 0.04 400 3.1 0.08 800 3.9 0.1
junction to case thermal resistance, theta jc (r q jc ), was measured using the cold plate technique with the cold plate temperature used as the "case" temperature. the reference specifications are mil-std 883d, method 1012.1 and semi g30-88. sample size was 5. theta jc average standard deviation theta jc ave + 3 std. dev. ?/watt ?/watt ?/watt 8.9 0.07 9.1 junction to board thermal resistance theta jb (r q jb ) was measured using a cold plate technique with the cold plate in thermal contact with the bottom of the printed circuit board. the board temperature was measured with a thermocouple soldered to a center lead along one side of the package where the lead was soldered to the board. the measurement was taken using the 4 conductor layer printed circuit board described below. sample size is 5. theta jb average standard deviation theta jb ave + 3 std. dev. ?/watt ?/watt ?/watt 18.8 0.19 19.4 junction to ambient thermal resistance (theta ja) was also measured on a four layer test board. the test board was a 115x102 mm board designed to test 0.5 mm pitch qfp packages from 208 to 304 leads with two solid internal plane of 1 oz nominal thickness (0.033 mm thick). the trace pattern on the component side had a trace width of 0.231 mm, trace thickness of 0.0715 mm. sample size was 5. do not use this data without special footnote indicating that the results were measured on a board with two solid internal planes. convection theta ja average standard deviation theta ja ave + 3 std. dev. ?/watt ?/watt ?/watt natural 26.1 0.11 26.4 100 ft/min 23.8 0.13 24.2 200 22.8 0.13 23.2 400 21.3 0.19 21.9 800 18.6 0.16 19.1 semi specifications are available from semiconductor equipment and materials international at (415) 964-5111. mil-spec and eia/jesd (jedec) specifications are available from global engineering documents at 800-854-7179 or 303-397-7956.
email phone fax from bennett joiner rxmn60 512-933-7597 512-933-6344 ruth reinhardt rbdt20 512-933-6407 512-933-6344
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